Corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder butt joints fabricated by conventional reflow and microwave hybrid heating

Solder butt joints Cu/Sn-3.0Ag-0.5Cu/Cu was prepared by microwave hybrid heating (MHH) and conventional reflow then immerse in NaCl solution. Corrosion products obtained was confirmed as SnO, SnO2 and Sn3O (OH)2Cl2. The ultimate tensile strength (UTS) of MHH is 32.7 % greater than conventional reflow for untreated sample. The UTS reduction of 30 %- 40 % was due to active corrosion activity before it reduces to less than 10% after 14 days of immersion for both methods. The findings suggested that MHH gives positive advantages over conventional reflow by providing solder joints with higher strength and better corrosion resistance.