Industrial applications and opportunities for nondestructive evaluation of structural wood members

被引:8
|
作者
Beall, Frank C. [1 ]
机构
[1] Univ Calif Berkeley, Richmond, CA 94803 USA
来源
MADERAS-CIENCIA Y TECNOLOGIA | 2007年 / 9卷 / 02期
关键词
microwave; density; moisture content; mechanical properties; grading; radiation; adhesive bonding; adhesive curing; grain orientation; internal defect scanning;
D O I
10.4067/S0718-221X2007000200003
中图分类号
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号
0805 ; 080502 ; 0822 ;
摘要
This paper reviews techniques that can or have been used for determining the key properties of structural wood members, largely softwood lumber and structural panels. For solid wood materials, moisture content, density, and defects are underlying basic properties that must be assessed independently to arrive at structural values. In reconstituted materials, an additional variable, adhesive quality dominates. In addition to reviewing these properties, an assessment is provided for the state of maturity of the relevant technologies.
引用
收藏
页码:127 / 134
页数:8
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