Characterization and Monitoring Platform for Single-Photon Avalanche Diodes in the Development of a Photon-to-Digital Converter Technology

被引：1

作者：

Parent, Samuel ^{[1
]}

Vachon, Frederic ^{[1
]}

Gauthier, Valerie ^{[1
]}

Paquette, Alexandre ^{[1
]}

Deschamps, Jacob ^{[1
]}

Rossignol, Tommy ^{[1
]}

Arsenault, Philippe ^{[1
]}

Paulin, Caroline ^{[1
]}

Lemay, Joel ^{[1
]}

Roy, Nicolas ^{[1
]}

Cote, Maxime ^{[2
]}

Dupont, Denis ^{[2
]}

Martel, Stephane ^{[2
]}

Dautet, Henri ^{[1
]}

Charlebois, Serge A. ^{[1
]}

Pratte, Jean-Francois ^{[1
]}

机构：

[1] Univ Sherbrooke, Inst Interdisciplinaire Innovat Technol, Sherbrooke, PQ, Canada

[2] Teledyne DALSA Semicond, Bromont, PQ, Canada

来源：

2022 IEEE 34TH INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS) | 2022年

关键词：

Single-Photon Avalanche Diodes; Wafer Probing; Photon-to-Digital Converter; Characterization and Monitoring;

D O I：

10.1109/ICMTS50340.2022.9898180

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports on a wafer-level test platform for Single-Photon Avalanche Diodes (SPADs) manufactured at Teledyne DALSA (Canada) and designed by Universite de Sherbrooke. The platform enables in-foundry end-of-process active testing of SPADs in Geiger-mode, thanks to a dedicated integrated circuit and probe card installed on a wafer prober.

引用

页码：155 / 158

页数：4

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