Advanced wet cleaning using novel nozzle and functional ultrapure water in next generation FPD/LSI manufacturing

被引：1
|
作者：
Mitsumori, KI [1 ]
Nobuaki, H [1 ]
Takahashi, N [1 ]
Imaoka, T [1 ]
Ohmi, T [1 ]
机构：
[1] ALPS ELECT CO Ltd, Koto Ku, Tokyo 1368631, Japan
来源：
ISSM 2000: NINTH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, PROCEEDINGS | 2000年
关键词：
cleaning; functional ultrapure water; ultrasonic; BPP-nozzle;
D O I：
10.1109/ISSM.2000.993680
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The advanced wet cleaning method relates to the fluid feed nozzle with ultrasonic that is employed for removing contaminants from the surfaces of the substrates during processes for manufacturing LCD or ULSI. In this method, the pressure among feeding and discharging cleaning solution and ambient air is balanced This balance causes to feed adequate thickness of cleaning solution to remove particles from the substrate and to discharge waste solution and removed particles. The cleaning solution consumption of this method is less than 1/10 of conventional shower type nozzle with ultrasonic that has been popular in LCD fabrications. We named the nozzle using this method "balanced push-pull nozzle" (BPP-nozzle). The BPP-nozzle with ultrasonic and hydrogen-dissolved ultrapure water can remove PSL particles from above 30000 to about 100 in the Si-wafer cleaning.
引用
收藏
页码：329 / 332
页数：4
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