The Characteristics of High-Speed Cylindrical Grinding of Silicon Carbide and its influence on the Surface Layer

There has been increased interest in the use of advanced ceramic materials such as silicon carbide in the recent past, due to its unique physical and mechanical properties. However, the increase of the machining rate relies on the understanding of material removal mechanism on the microstructural scale and the relationship between the grinding characteristics and formation of surface/subsurface machining-induced damage. In this paper, grinding characteristics and surface integrity of SiC ground with diamond wheel on cylindrical grinding machine have been investigated. The grinding chip and the ground surface damage have been studied with scanning electron microscope (SEM). In particular the residual stress distribution has been analyzed by a single exposure technique d - sin(2)(Psi) method with the aid of powder X-ray diffractometer.