RF/microwave characterization of multilayer ceramic-based MCM technology

被引：40
|
作者：
Sutono, A [1 ]
Pham, AVH
Laskar, J
Smith, WR
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Packaging Res Ctr, Atlanta, GA 30332 USA
[2] Clemson Univ, Dept Elect & Comp Engn, Clemson, SC 29634 USA
[3] Natl Semicond Corp, Newport Beach, CA 92663 USA
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 03期
基金：
美国国家科学基金会;
关键词：
embedded passives; multi-layer; RF/microwave; 3-D inductors;
D O I：
10.1109/6040.784480
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We present RF/microwave characterization of a 20-layer ceramic-based multichip module (MCM-C) on low temperature co-fired ceramic (LTCC). We investigated material properties and performance of embedded passives by design, fabrication and characterization of planar and multilayer integral inductors, Uniform dielectric constant, low loss property and high Q passives fabricated using this technology demonstrate the feasibility for implementing hybrid RF/micromave systems.
引用
收藏
页码：326 / 331
页数：6
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