Reliability of new packaging concepts

Commercial pressures require that modern microelectronics deliver more complexity in less space and more reliability at lower cost. Today, most of the microelectronics packaging needs are met by semiconductor devices in plastic surface mount (SM) packages. Microelectronics packaging of the future will be either bare chip or chip size/scale packaging (CSP). Of the 40 billion SM packaged ICs manufactured in 1998, CSPs will be a small 1.1% but growing at 62% (compound annual growth rate (CAGR). The use of direct bonded chip-on-board (COB) and flip chip (FC) technology for custom solutions may match the growth of CSPs. The popcorn problem of existing plastic packages is solved. The problem which was more severe with the smaller and thinner encapsulations of CSPs, is also solved with modern hydrophobic materials and new package designs. The portents are promising for reliable CSP and COB solutions.