Thermal Characterization of Endogenously Heated Printed Circuit Boards with Embedded Resistive Layers

被引：0
|
作者：
Seehase, Dirk [1 ]
Neiser, Arne [2 ]
Lange, Fred [1 ]
Novikov, Andrej [1 ]
Nowottnick, Mathias [1 ]
机构：
[1] Univ Rostock, Inst Elect Appliances & Circuits, Rostock, Germany
[2] SEHO Syst GmbH, Prod Mangement, Kreuzwertheim, Germany
来源：
2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2018年
关键词：
reflow soldering; pcb; embedded; heating; resistive layer;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper will focus on the thermal characterization of resistive layers in conjunction with printed circuit board (PCB) substrate material. The electrical parameters that are required to achieve endogenous heating up to temperatures of 200 degrees C and more are studied. Also the correlation between temperature and electrical resistance at the here used heating materials is investigated and described. Final thermal measurements on build-up samples with embedded heating layers are conducted and evaluated.
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页数：9
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