UNDERSTANDING COPPER DISSOLUTION AND SURFACE FINISH IN ROHS SELECTIVE SOLDER EQUIPMENT

被引：0
|
作者：
Shoaf, Thomas [1 ]
机构：
[1] Plexus, Milwaukee, WI 53201 USA
来源：
ELECTRONICS WORLD | 2015年 / 121卷 / 1955期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：32 / +
页数：6
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