A method for measuring thermal conductivity of paste materials

被引：0

作者：

Feng, Wilson ^{[1
]}

Zhao, Fanny ^{[1
]}

Shieh, Brian ^{[1
]}

Lee, S. W. Ricky ^{[1
,2
,3
]}

机构：

[1] HKUST LED FPD Technol R&D Ctr Foshan, Foshan, Guangdong, Peoples R China

[2] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China

[3] Hong Kong Univ Sci & Technol, Ctr Adv Microsyst Packaging, Kowloon, Hong Kong, Peoples R China

来源：

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年

关键词：

thermal conductivity; finite element modeling; composite; paaste materials;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid samples was developed. Three types of paste materials were investigated. From detailed comparisons, it could be concluded that the accuracy of this method is more than 95%. Consequently, the proposed method was validated.

引用

页码：510 / 513

页数：4

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