ELECTRICAL TOMOGRAPHY SENSING AND DIELECTROPHORESIS IN MICROCHANNEL FOR 3D PARTICLE MIXING

被引:0
|
作者
Othman, Nur Tantiyani Ali [1 ]
Choi, Je-Eun [1 ]
Takei, Masahiro [1 ]
机构
[1] Nihon Univ, Dept Mech Engn, Coll Sci & Technol, Tokyo 1018308, Japan
来源
PROCEEDINGS IF THE ASME 9TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNELS AND MINICHANNELS 2011, VOL 1 | 2012年
关键词
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
The present study describes the electrical tomography sensing and dielectrophoresis (DEP) force for visualize the 3D particle mixing in the microchannel system. In the presence of non-uniform electric fields generated by point microelectrodes, the dynamic distribution behaviors of a polystyrene particle and deionized water had been investigated in this system. Microchannel was fabricated with five cross sections where 12 electrodes were installed for each measurement plane. In this experiment, the relationship between electric field frequency and DEP force of particles are calculated at different electric frequencies and diameter of particles. The applied electric field intensities are E=+/- 1 V/mm, +/- 3 V/mm and +/- 5 V/mm while the electric field frequencies are f=1 kHz, 10 kHz, 100 kHz and 1 MHz and the diameter of particles are 1.3 mu m, 1.5 mu m and 2.0 mu m are investigated in this experiment. Simultaneously, imaged by manipulating tomography sensing at cross section A, C and D and the coupled DEP forces at cross section B and D, the particles flowing had been visualized and concentrate uniformly at near the outlets. The electrical capacitances and DEP forces between the electrode pairs of the microchannel were measured and the ECT tomograms representing the particle distribution were constructed from the measured capacitance data for each cross section in microchannel.
引用
收藏
页码:211 / 217
页数:7
相关论文
共 50 条
  • [1] 3D TOMOGRAPHIC TRANSITION OF PARTICLE DISTRIBUTION IN MICROCHANNEL
    Choi, Je-Eun
    Takei, Masahiro
    PROCEEDINGS OF THE ASME/JSME/KSME JOINT FLUIDS ENGINEERING CONFERENCE 2011, VOL 1, PTS A-D, 2012, : 4001 - 4006
  • [2] 3D electrical conductivity tomography of volcanoes
    Ahmed, A. Soueid
    Revil, A.
    Byrdina, S.
    Coperey, A.
    Gailler, L.
    Grobbe, N.
    Viveiros, F.
    Silva, C.
    Jougnot, D.
    Ghorbani, A.
    Hogg, C.
    Kiyan, D.
    Rath, V.
    Heap, M. J.
    Grandis, H.
    Humaida, H.
    JOURNAL OF VOLCANOLOGY AND GEOTHERMAL RESEARCH, 2018, 356 : 243 - 263
  • [3] 3D tomography for multistatic GPR subsurface sensing
    Pereira, Mauricio
    Zhang, Yu
    Orfeo, Dan
    Burns, Dylan
    Huston, Dryver
    Xia, Tian
    RADAR SENSOR TECHNOLOGY XXII, 2018, 10633
  • [4] Steps towards 3D Electrical Impedance Tomography
    Schullcke, Benjamin
    Gong, Bo
    Moeller, Knut
    2015 37TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC), 2015, : 5323 - 5326
  • [5] Planar array 3D electrical capacitance tomography
    Ye, Z.
    Banasiak, R.
    Soleimani, M.
    INSIGHT, 2013, 55 (12) : 675 - +
  • [6] Development on 3D Electrical Capacitance Tomography Instrument
    Fu Wenli
    Zhao Jinchuang
    Lei Jingjie
    CCDC 2009: 21ST CHINESE CONTROL AND DECISION CONFERENCE, VOLS 1-6, PROCEEDINGS, 2009, : 4486 - 4488
  • [7] Fast and robust 3D electrical capacitance tomography
    Li, Y.
    Holland, D. J.
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2013, 24 (10)
  • [8] Wavefront sensing for 3D particle metrology and velocimetry
    Angarita-Jaimes, N.
    McGhee, E.
    Chennaoui, M.
    Campbell, H. I.
    Zhang, S.
    Towers, C. E.
    Greenaway, A. H.
    Towers, D. P.
    INTERFEROMETRY XIII: TECHNIQUES AND ANALYSIS, 2006, 6292
  • [9] APPLICATION OF ELECTRICAL CAPACITANCE TOMOGRAPHY FOR DENSE CROSSSECTIONAL PARTICLE MIGRATION IN A MICROCHANNEL
    Othman, Nur Tantiyani Ali
    Takei, Masahiro
    JURNAL TEKNOLOGI, 2015, 77 (17): : 85 - 90
  • [10] Utilizing a coil to realize 3D electrodes for dielectrophoresis-based particle concentration
    Fathy, Jino
    Lai, Yongjun
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2020, 30 (03)