Refining MCM thermal simulation models with test vehicles

被引：0
|
作者：
Bennett, DJ [1 ]
DeMuth, BT [1 ]
Pines, BE [1 ]
机构：
[1] US DEPT DEF,FT GEORGE G MEADE,MD 20755
来源：
1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷
关键词：
thermal analysis; thermal modeling; thermal simulation;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：323 / 328
页数：6
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