Advanced broadband MEMS infrared emitter based on high temperature-resistant nanostructured surfaces and packaging solutions for harsh environments

被引：1

作者：

Biermann, S. ^{[1
]}

Magi, A. ^{[1
]}

Sachse, P. ^{[1
]}

Hoffmann, M. ^{[2
]}

Wedrich, K. ^{[3
]}

Mueller, L. ^{[3
]}

Koppert, R. ^{[4
]}

Ortlepp, T. ^{[5
]}

Baldauf, J. ^{[6
]}

机构：

[1] Microhybrid Elect GmbH, Heinrich Hertz Str 8, D-07629 Hermsdorf, Germany

[2] Ruhr Univ Bochum, Lehrstuhl Mikrosystemtech, Univ Str 150, D-44801 Bochum, Germany

[3] TU Ilmenau, IMN MacroNanoR, Gustav Kirchhoff Str 7, D-98693 Ilmenau, Germany

[4] Siegert Thinfilm Technol GmbH, Robert Friese Str 3, D-07629 Hermsdorf, Germany

[5] CMOS IR GmbH, Konrad Zuse Str 14, D-99099 Erfurt, Germany

[6] CiS Forschungsinst Mikrosensor GmbH, Konrad Zuse Str 14, D-99099 Erfurt, Germany

来源：

TERAHERTZ, RF, MILLIMETER, AND SUBMILLIMETER-WAVE TECHNOLOGY AND APPLICATIONS XIII, 2020 | 2020年 / 11279卷

关键词：

infrared source; infrared emitter; black silicon emitter; infrared component; infrared spectroscopy; optical gas measurement; NDIR gas measurement; hermetic packaging for harsh environments;

D O I：

10.1117/12.2545119

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

An advanced infrared emitter, consisting of a non-periodic silicium-microstmcture and a platinium-nano-composition, which enables extraordinary highly emission intensities is presented. A spectral broadband emission coefficient epsilon of nearly 1 is achieved. The foundation of the emitter is a MEMS hot plate design containing a high temperature stable molybdenum silicide resistance heater layer embedded in a multilayer membrane consisting of silicon nitride and silicon oxide. The temperature resistance of the silicon-platinum micro-nanostructure up to 800 degrees C is secured by a SiO2 protection layer. The long-term stability of the spectral behavior at 750 degrees C has been demonstrated over 10,000 h by FTIR measurements. The low thermal mass of the multilayer MEMS membrane leads to a time constant of 28 ms which enables high chopper frequencies. A precondition for long term stability under rough conditions is a real hermetic housing. High temperature stable packaging technologies for infrared MEMS components were developed.

引用

页数：15