Fabrication, structure, and property of epoxy-based composites with metal-insulator core-shell structure fillers

被引:10
|
作者
Niu, Yujuan [1 ,2 ]
Bai, Yuanyuan [1 ,2 ]
Yu, Ke [1 ,2 ]
He, Li [1 ,2 ]
Xiang, Feng [1 ,2 ]
Wang, Hong [1 ,2 ]
机构
[1] Xi An Jiao Tong Univ, Elect Mat Res Lab, Key Lab Minist Educ, Dept Elect Sci & Technol, Xian 710049, Peoples R China
[2] Xi An Jiao Tong Univ, Dept Elect Sci & Technol, Int Ctr Dielect Res, Xian 710049, Peoples R China
基金
美国国家科学基金会;
关键词
HIGH DIELECTRIC PERMITTIVITY; POLY(VINYLIDENE FLUORIDE); THRESHOLD;
D O I
10.1557/jmr.2013.248
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The Ag@SiO2 core-shell structure nanoparticles prepared by chemical method were dispersed into epoxy matrix. By comparing with the epoxy-based composites filled with the mixed Ag and SiO2 nanoparticles (Ag + SiO2), it is found that the Ag@SiO2 core-shell structure fillers had important effects on the improved dielectric properties of the Ag@SiO2/epoxy composites. The core-shell structure fillers introduce a duplex interfacial polarization and a small number of free charge carriers, which enhance the dielectric permittivity of the composites. At the same time, the insulating SiO2 shell layer changes the interfacial interaction between the Ag filler and the epoxy matrix, not only avoiding Ag particles to connect directly and aggregate together but also providing a rough surface to contact with the epoxy host, which enhances the compatibility between the Ag@SiO2 fillers and the epoxy matrix. As the Ag@SiO2 packing ratio increases, the permittivity of the composites straightly increases and the loss tangent decreases, reaching the maximum and minimum respectively with the filler loading up to 60%.
引用
收藏
页码:2644 / 2649
页数:6
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