Thermo-mechanical simulation of PCB with embedded components

被引：19

作者：

Kpobie, W. ^{[1
]}

Martiny, M. ^{[1
]}

Mercier, S. ^{[1
]}

Lechleiter, F. ^{[2
]}

Bodin, L. ^{[2
]}

des Etangs-Levallois, A. Lecavelier ^{[3
]}

Brizoux, M. ^{[3
]}

机构：

[1] Univ Lorraine, Lab Etud Microstruct & Mecan Mat LEM3, UMR CNRS 7239, F-57045 Metz, France

[2] CIMULEC, ZI Les Jonquieres, F-57365 Ennery, France

[3] Thales Global Serv, 19-21 Av Moran Saulnier, F-78140 Velizy Villacoublay, France

来源：

MICROELECTRONICS RELIABILITY | 2016年 / 65卷

关键词：

Finite elements simulation; Printed circuit board; Thermo-mechanical coupling; Embedded components; STANDARD REFERENCE MATERIAL; PRINTED-CIRCUIT BOARDS; RELIABILITY;

D O I：

10.1016/j.microrel.2016.08.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In recent years, in order to increase density and performance of electronic boards, components are embedded in internal layers of printed circuit boards (PCBs). The reliability of this new technology has to be investigated to ensure the working of the electronic boards submitted to harsh environment and long mission profiles. To study the thermo-mechanical behavior of these boards, finite element simulations have been performed. It is observed that embedded passive chips are subjected to complex loading during the lamination process, due mostly to shrinkage of the resin, differences in material properties and also because of temperature excursion. The effects of material parameters and of the geometrical configuration are investigated in details. It will be shown that the generated stresses are not critical for the passive chip size considered in the present work. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：108 / 130

页数：23

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