A Physical Verification Methodology for 3D-ICs Using Inductive Coupling

被引：0

作者：

Omori, Tatsuo ^{[1
]}

Shiba, Kota ^{[1
]}

Kosuge, Atsutake ^{[2
]}

Hamada, Mototsugu ^{[2
]}

Kuroda, Tadahiro ^{[2
]}

机构：

[1] Univ Tokyo, Dept Elect Engn & Informat Syst, Tokyo, Japan

[2] Univ Tokyo, Syst Design Lab, Tokyo, Japan

来源：

2021 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) | 2021年

关键词：

ThruChip Interface; 3D-IC; Physical Verification; Inductive Coupling; Automation;

D O I：

10.1109/EDAPS53774.2021.9657043

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We propose a physical verification methodology for 3D-ICs utilizing inductive coupling that includes a verification of the coil polarity and the distance between communicating coils. Additional layout layers are placed on the coils and then verification is done by a program written in SKILL. The proposed method also supports the rotation, flipping, and offset of the stacked chips. By using the proposed methodology in conjunction with commercial verification tools for 3D-ICs, the design efficiency of inductively coupled 3D-ICs is dramatically improved.

引用

页数：3

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