Microelectronics for the Real World: "Moore" versus "More than Moore"

Memories and microprocessors improvements rely on the continued scaling in silicon based CMOS technologies known as "Moore's" law. However, new classes of products are emerging that provide additional value based on functional innovation and diversification instead of scaling. This functional diversification is being called "More-than-Moore". Product innovation in "More-than-Moore" technologies is differentiated by circuit design, architecture, embedded software and unique process technology. These innovations enable the use of older, proven technologies in highly reliable products. This approach allows for non-digital functions such as RF, power control, passive components, sensors and actuators to migrate from the system board level into a package level (SiP) or chip level (SoC) implementation. The objective of "More-than-Moore" is to incorporate digital and non-digital functionality into compact systems. "More-than-Moore" technologies are application specific and focus on the interface between the "Analog" and the digital world. In this paper we will discuss the applications of "More-than-Moore" concept and its utility in real life.