This paper studies the development of new multifunctional liquid crystal polymeric composites filled with graphene nano platelets (GNPs) for electronic packaging applications. A series of parametric studies were conducted to study the effect of GNP content on the thermal conductivity of LCP-based nanocomposites. Graphene, ranging from 10 wt. % to 50 wt. %, were melt-compounded with LCP using a twin-screw compounder. The extrudates were ground and compression molded into small disc-shaped specimens. The thermal conductivity of LCP matrix was observed to have increased by more than 1000% where as the electrical conductivity increased by 13 orders of magnitude with the presence of 50 wt% GNP fillers. The morphology of the composites was analyzed using SEM micrographs to observe the dispersion of filler within the matrix. These thermally conductive composites represent potential cost-effective materials. to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.
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S China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R ChinaS China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
Liang, Ji-Zhao
Du, Qiang
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S China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R ChinaS China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
Du, Qiang
Tsui, Gary Chi-Pong
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Hong Kong Polytech Univ, Dept Ind & Syst Engn, Hong Kong, Hong Kong, Peoples R ChinaS China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
Tsui, Gary Chi-Pong
Tang, Chak-Yin
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Hong Kong Polytech Univ, Dept Ind & Syst Engn, Hong Kong, Hong Kong, Peoples R ChinaS China Univ Technol, Res Div Green Funct Mat & Equipment, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
机构:
Xinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R ChinaXinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R China
Tang, Xinqiao
Hu, Huiji
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Xinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R ChinaXinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R China
Hu, Huiji
Qu, Zhe
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Xinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R ChinaXinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R China
Qu, Zhe
Meng, Fan-Bao
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Northeastern Univ, Coll Sci, Shenyang, Peoples R ChinaXinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R China
Meng, Fan-Bao
Wang, Jiwei
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Ningde Normal Univ, Med Coll, Fujian Prov Univ Engn Res Ctr Mindong She Med, Ningde, Peoples R ChinaXinyang Normal Univ, Dept Phys & Elect Engn, Xinyang, Peoples R China
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Queen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Nanoforce Technol Ltd, London E1 4NS, EnglandQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Porwal, Harshit
Tatarko, Peter
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CEITEC IPM, ASCR, Inst Phys Mat, Brno 61662, Czech RepublicQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Tatarko, Peter
Grasso, Salvatore
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Queen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Nanoforce Technol Ltd, London E1 4NS, EnglandQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Grasso, Salvatore
Hu, Chunfeng
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Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R ChinaQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Hu, Chunfeng
Boccaccini, Aldo R.
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Univ Erlangen Nurnberg, Dept Mat Sci & Engn, D-91058 Erlangen, GermanyQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Boccaccini, Aldo R.
Dlouhy, Ivo
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CEITEC IPM, ASCR, Inst Phys Mat, Brno 61662, Czech RepublicQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Dlouhy, Ivo
Reece, Mike J.
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Queen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England
Nanoforce Technol Ltd, London E1 4NS, EnglandQueen Mary Univ London, Sch Engn & Mat Sci, London E1 4NS, England