Optimal Cooling System Design for Increasing the Crystal Growth Rate of Single-Crystal Silicon Ingots in the Czochralski Process Using the Crystal Growth Simulation

被引:16
|
作者
Jeon, Hye Jun [1 ]
Park, Hyeonwook [1 ]
Koyyada, Ganesh [1 ]
Alhammadi, Salh [1 ]
Jung, Jae Hak [1 ]
机构
[1] Yeungnam Univ, Chem Engn Dept, Gyongsan 38541, South Korea
基金
新加坡国家研究基金会;
关键词
single crystal silicon; cooling system design; pulling speed; crystal growth rate; Czochralski process; crystal growth simulation; AXIAL TEMPERATURE-GRADIENT; INTRINSIC POINT-DEFECTS; BULK DEFECTS; DYNAMICS; DEPENDENCE; INTERFACE; VACANCIES; STRESS; OXYGEN; IMPACT;
D O I
10.3390/pr8091077
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Here, we report a successfully modified Czochralski process system by introducing the cooling system and subsequent examination of the results using crystal growth simulation analysis. Two types of cooling system models have been designed, i.e., long type and double type cooling design (LTCD and DTCD) and their production quality of monocrystalline silicon ingot was compared with that of the basic type cooling design (BTCD) system. The designed cooling system improved the uniformity of the temperature gradient in the crystal and resulted in the significant decrease of the thermal stress. Moreover, the silicon monocrystalline ingot growth rate has been enhanced to 18% by using BTCD system. The detailed simulation results have been discussed in the manuscript. The present research demonstrates that the proposed cooling system would stand as a promising technique to be applied in CZ-Si crystal growth with a large size/high pulling rate.
引用
收藏
页数:13
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