Comparative study of thermal and plasma enhanced atomic layer deposition of aluminum oxide on graphene

被引:0
|
作者
Clemente, I. [1 ,2 ]
Miakonkikh, A. [1 ,2 ]
Kononenko, O. [3 ,4 ]
Matveev, V. [3 ]
Rudenko, K. [1 ,2 ]
机构
[1] Inst Phys & Technol, Moscow 117218, Russia
[2] Moscow Inst Phys & Technol, Dolgoprudnyi 147001, Russia
[3] Russian Acad Sci, Inst Microelect Technol & High Pur Mat, Chernogolovka 142432, Moscow Region, Russia
[4] Natl Univ Sci & Technol MISiS, Moscow 119049, Russia
关键词
D O I
10.1088/1742-6596/917/3/032039
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Atomic layer deposition of alumina on graphene was studied in thermal and plasma enhanced process. Deposition was controlled by in situ ellipsometry every half cycle, which allows measuring of Al2O3 thickness and graphene equivalent thickness during the process. Properties of graphene were measured by Raman spectroscopy prior and after deposition of dielectric layer. It was shown that plasma enhanced deposition leads to decrease of effective graphene thickness, while thermal deposition does not affect graphene layer. No substantial nucleation lag was observed in both types of deposition.
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页数:4
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