Degradation of tin-lead solder joints via interaction with 2-ethyl-hexanoic acid

Electrical hardware was exposed to a corrosive agent, 2-ethyl-hexanoic acid (2-EHA), due to the decomposition of a packaging foam used in their assembly. Metallography, scanning electron microscopy (SEM), and gas chromatography/mass spectrometry, of the initial failure, a high voltage connector, and of functioning hardware will be discussed. To determine the probable life of electronic packages in service, an accelerated aging test was developed and performed on representative electrical hardware. The effects of the accelerated aging test was determined using metallographic and SEM techniques. This paper will demonstrate the utility of performing accelerated aging studies to determine the long term reliability of functioning hardware exposed to 2-EHA or other corrosive agents.