New Surface Treatment Method for Copper Foils to Improve Signal Integrity of Printed Circuit Board

被引：0
|
作者：
Chen, Chia-Ling [1 ]
Chen, Fu-Je [1 ]
Chen, Meng-Hsien [1 ]
Teng, Ming-Kai [1 ]
Chen, James [1 ]
Lin, Shi-Ching [1 ]
机构：
[1] Nan Ya Plast Corp, Copper Foil Technol Dept, Elect Mat Div, 2 Chung Yang Ind Complex, Chiayi, Taiwan
来源：
2016 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC) | 2016年
关键词：
eletrodeposited copper foil; roughened deposition; PCB; signal transmission loss;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The electrical and signal transmission characteristics of copper foil used in high-frequency and high-speed circuits depend on its surface roughness, microstructure of nodular layer and wire etching quality. This study presents the influence of copper foil manufacturing process on the transmission loss of printed circuit board (PCB) in high-frequency circuit applications. Experimental results indicated that a new surface treatment technique used in the preparation of TLC-Vl foil was able to obtain an ultra-low surface roughness (approximate to 1.2 mu m), satisfactory adhesion strength equivalent to the conventional roughened foil (NPMD foil), and excellent etching effect. In addition, less signal transmission loss over 10 GHz band due to this ultra-low roughness, low specific surface area and good etching quality of conductor line was also demonstrated by this new processing technique.
引用
收藏
页码：584 / 586
页数：3
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