Development of Indium bump bonding for the ATLAS Insertable B-Layer (IBL)

被引：3
|
作者：
Alimonti, G. [1 ,2 ]
Andreazza, A. [1 ,2 ]
Corda, G. [3 ]
Darbo, G. [4 ]
Di Gioia, S. [3 ]
Fiorello, A. [3 ]
Gariano, G. [4 ]
Gemme, C. [4 ]
Meroni, C. [4 ]
Rovani, A. [1 ,2 ]
Ruscino, E. [4 ]
机构：
[1] Ist Nazl Fis Nucl, I-20133 Milan, Italy
[2] Univ Milan, I-20133 Milan, Italy
[3] Selex Sistemi Integrati SpA, Rome, Italy
[4] Ist Nazl Fis Nucl, Sez Genova, I-16146 Genoa, Italy
来源：
JOURNAL OF INSTRUMENTATION | 2013年 / 8卷
关键词：
Solid state detectors; Hybrid detectors; Detector design and construction technologies and materials;
D O I：
10.1088/1748-0221/8/01/P01024
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
About half of the ATLAS pixel modules have been assembled with the Selex indium bump bonding process. The requirements of the ATLAS Insertable B-Layer (IBL) detector ask for larger and thinner chips, two critical parameters for bonding processes. We report on the research and development carried on with Selex to produce modules with 100 mu m thick and 18.8 x 20.2 mm(2) area read out chips bonded with indium bumps.
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收藏
页数：11
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