Photosensitive Polyimide for Packaging Applications

被引：28
|
作者：
Tomikawa, Masao [1 ]
Okuda, Ryoji [1 ]
Ohnishi, Hiroyuki [1 ]
机构：
[1] Toray Industries Ltd, Elect & Imaging Mat Res Labs, Otsu, Shiga 5200842, Japan
来源：
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2015年 / 28卷 / 01期
关键词：
Positive-tone photosensitive polyimide; low residual stress; low temperature curable;
D O I：
10.2494/photopolymer.28.73
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Recently packaging technologies progress so much for high density, low profile and small foot print. For those applications, Photo sensitive polyimide (PSPI) applied as a re-distribution layer for the package. The PSPI was required to have good adhesion to wiring metal with low temperature curable nature. We developed the PSPIs with low temperature curability for emerging packaging applications.
引用
收藏
页码：73 / 77
页数：5
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