LED packaging by ink-jet microdeposition of high-viscosity resin and phosphor dispersion

被引：3
|
作者：
Amemiya, Isao [1 ]
Nomura, Yuko [1 ]
Mori, Kenichi [1 ]
Yoda, Miho [1 ]
Takasu, Isao [1 ]
Uchikoga, Shuichi [1 ]
机构：
[1] Toshiba Co Ltd, Ctr Corp Res & Dev, Adv Elect Devices Lab, Saiwai Ku, Kawasaki, Kanagawa 2128582, Japan
来源：
2007 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXVIII, BOOKS I AND II | 2007年 / 38卷
关键词：
D O I：
10.1889/1.2785626
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The applicability of an ink-jet printing method to microdeposition of high-viscosity resin and phosphor dispersion for light-emitting-diode (LED) packaging was examined for the first time. An ultrasonic ink-jet printing method was used, in which ink droplets are ejected by focused ultrasonic beam from nozzle-less printhead For fabricating white LEDs, high-viscosity phosphor-dispersed resin was deposited to form an encapsulant dome, and hydrophobic surface treatment of the lead frame substrate enabled fabrication of a small encapsulant dome to improve color uniformity. A silicone microlens was deposited on at? encapsulant dome using the ink-jet method for light directivity jet printing is an control. The results show the ultrasonic inks applicable technique to optimize and modify on demand optical characteristics of the LED devices.
引用
收藏
页码：1603 / 1606
页数：4
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