Intensity of singular stress fields (ISSFs) in micro-bond test in comparison with ISSFs in pull-out test

被引：4
|
作者：
Chen, Dong [1 ]
Noda, Nao-Aki [1 ]
Takaki, Rei [1 ]
Sano, Yoshikazu [1 ]
机构：
[1] Kyushu Inst Technol, Dept Mech Engn, Tobata Ku, Sensui Cho 1-1, Kitakyushu, Fukuoka, Japan
来源：
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES | 2020年 / 183卷
关键词：
Micro-bond test; Fiber pull-out; Intensity of singular stress field (ISSF); Fiber/matrix interface; Finite element method (FEM); PHOTONIC CRYSTAL FIBER; INTERFACIAL BOND; ELASTIC WEDGES; COMPOSITES; STRENGTH; BIREFRINGENCE; BEHAVIOR; SENSOR; IFSS;
D O I：
10.1016/j.ijmecsci.2020.105817
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
Micro-bond test is often used to investigate fiber/matrix bonding behavior. In this experiment, the average shear stress is generally used as the interface strength without considering the singular stress. Therefore, in this paper, the intensity of singular stress field (ISSF) is newly analyzed at the fiber entry/exit points. The obtained ISSFs at the fiber entry point in micro-bond test are compared to the single fiber pull-out under the same fiber geometry. The results show that care should be taken for the previous micro-bond test geometry since the ISSF varies sensitively depending on the testing geometry. To control the initial fiber/matrix debonding and evaluate the bonding behavior correctly, suitable testing geometries are proposed in micro-bond testing.
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收藏
页数：9
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