Tape casting: A historical review, current status and potential for the future

被引：0
|
作者：
Mistler, RE [1 ]
机构：
[1] Richard E Mistler Inc, Morrisville, PA 19067 USA
来源：
MULTILAYER ELECTRONIC CERAMIC DEVICES | 1999年 / 97卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Since its inception, described in a paper by G.N. Howatt (1), who was granted a subsequent patent in 1952 (2), tape casting has been used to produce thin layers of ceramic-loaded polymers which can be used as single layers or can be stacked and laminated into multilayered structures. Today tape casting is the basic fabrication process which provides the materials which are the backbone of two, multibillion dollar industries: multilayered capacitors and multilayered ceramic packages. In addition many startup products such as multilayered inductors, multilayered varistors, piezoelectrics, ceramic fuel cells, and lithium ion battery components are dependent upon tape casting technology. A brief history and current status along with potential future developments are discussed.
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收藏
页码：87 / 101
页数：15
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