Cyclic deformation features of a copper bicrystal with an embedded grain and surrounding grain boundary

被引:14
|
作者
Zhang, ZF [1 ]
Wang, ZG [1 ]
机构
[1] Chinese Acad Sci, Met Res Inst, State Key Lab Fatigue & Fracture Mat, Shenyang 110015, Peoples R China
关键词
copper bicrystal; embedded grain; grain boundary (GB); cyclic stress-strain (CSS) curve; slip morphology; dislocation pattern;
D O I
10.1016/S0921-5093(99)00312-3
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Cyclic stress-strain response, surface slip morphology and saturation dislocation patterns in a copper bicrystal with an embedded grain G(E) and a surrounding grain boundary (GB) were investigated and compared with those of its matrix monocrystal by multi-step cyclic straining at room temperature in air. The experimental results showed that the cyclic stress-strain (CSS) curve of the matrix monocrystal exhibited a plateau region with the saturation resolved shear stresses of 28.8-29.4 MPa in the plastic resolved shear strain range of 4.7 x 10(-4)-3.18 x 10(-3). However, the copper bicrystal displayed relatively higher saturation stresses of 32.2-36.0 MPa, if modified by the orientation factor of the matrix grain, indicating no apparent plateau region in its CSS curve. Surface observations revealed that the primary slip system was dominant in both grains G(M) and G(E) except near the surrounding GB. By the electron channeling contrast (ECC) technique in scanning electron microscopy (SEM), the dislocation patterns of the bicrystal and the matrix monocrystal were observed. It was found that the two-phase structure of persistent slip bands (PSBs) and dislocation veins can nucleate in both grains G(M) and G(E) after cyclic deformation of the bicrystal. Based on the experimental results above, the effects of the surrounding GB and the embedded grain G(E) on the cyclic stress-strain response of the bicrystal were discussed. Those results might provide an experimental evidence for understanding the difference in CSS curves between copper single- and poly-crystals. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:449 / 457
页数:9
相关论文
共 50 条
  • [2] Cyclic deformation behavior and intergranular fatigue cracking of a copper bicrystal with a parallel grain boundary
    Zhang, ZF
    Wang, ZG
    Hu, YM
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 272 (02): : 410 - 417
  • [3] Tensile deformation behavior of copper bicrystal with perpendicular grain boundary
    Li, Fa-Dong
    Li, Yu-Long
    Suo, Tao
    Tang, Zhong-Bin
    Guo, Ya-Zhou
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2012, 22 (05): : 1283 - 1291
  • [4] Cyclic deformation and dislocation structure evolution of a copper bicrystal with components rotating gradually along the grain boundary
    Li, Y
    Li, SX
    Li, GY
    Lu, K
    ZEITSCHRIFT FUR METALLKUNDE, 2003, 94 (08): : 871 - 875
  • [5] Effect of the grain boundary on the evolution of deformation in a bicrystal
    A. Ziegler
    G. H. Campbell
    M. Kumar
    J. S. Stölken
    Journal of Materials Science, 2005, 40 : 3225 - 3229
  • [6] Effect of the grain boundary on the evolution of deformation in a bicrystal
    Ziegler, A
    Campbell, GH
    Kumar, M
    Stölken, JS
    JOURNAL OF MATERIALS SCIENCE, 2005, 40 (12) : 3225 - 3229
  • [7] CRYSTALLINITY DEPENDENCE OF GRAIN AND GRAIN BOUNDARY STRENGTH OF A BICRYSTAL STRUCTURE OF COPPER
    Suzuki, Ken
    Fan, Yiqing
    Luo, Yifan
    PROCEEDINGS OF THE ASME 2020 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2020, VOL 13, 2020,
  • [8] Dynamic twin nucleation at grain boundary in copper bicrystal
    Miura, H
    Sakai, T
    Mogawa, R
    Goffstein, G
    RECRYSTALLIZATION AND GRAIN GROWTH, PTS 1 AND 2, 2004, 467-470 : 1217 - 1222
  • [9] CONTRIBUTION OF GRAIN-BOUNDARY TO TENSILE DEFORMATION OF ALUMINUM BICRYSTAL
    MIZUSHIMA, T
    MINEGISHI, T
    SAIKAWA, H
    YAMANE, T
    ARAKI, H
    SAJI, S
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1993, 12 (04) : 239 - 240
  • [10] Effects of crystallographic orientation and grain boundary on cyclic deformation in copper crystals
    Wang, ZG
    Li, XW
    Zhang, ZF
    Li, SX
    FATIGUE '99: PROCEEDINGS OF THE SEVENTH INTERNATIONAL FATIGUE CONGRESS, VOLS 1-4, 1999, : 93 - 104