Fabrication of top-down gold nanostructures using a damascene process

被引:7
|
作者
Merhej, Mouawad [1 ,2 ,3 ,4 ]
Drouin, Dominique [1 ,2 ]
Salem, Bassem [3 ,4 ]
Baron, Thierry [3 ,4 ]
Ecoffey, Serge [1 ,2 ]
机构
[1] Univ Sherbrooke, CNRS, LN2, UMI 3463, 3000 Blvd Univ, Sherbrooke, PQ J1K 0A5, Canada
[2] Univ Sherbrooke, 3IT, 3000 Blvd Univ, Sherbrooke, PQ J1K 0A5, Canada
[3] Univ Grenoble Alpes, LTM, F-38000 Grenoble, France
[4] CNRS, LTM, F-38000 Grenoble, France
关键词
Gold; Chemical mechanical planarization; Removal rate; Damascene; Micro-nano-structures; CHEMICAL-MECHANICAL PLANARIZATION; SILICON;
D O I
10.1016/j.mee.2017.02.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, we propose a damascene process to fabricate embedded gold micro- and nano-structures at the same time. We present a systematic study of the material removal rate (MRR) and the selectivity on both gold and silicon dioxide. The embedded microstructures are 2 pm wide and 60 nm deep, while the nanostructures widths vary from 70 nm to 500 nm for a 50 nm depth. Moreover, we highlight the contribution of the CMP in polishing the surfaces of gold films. Morphological characterizations are performed using mechanical profilometry, Atomic Force Microscopy (AFM), and Scanning Electron Microscopy (SEM). MRR and selectivity are evaluated as a function of time, applied pressure, platen rotation speed, and slurry flow. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:41 / 45
页数:5
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