Synthesis and Characterization of Ultra-fine Bimetalllic Ag-Cu Nanoparticles as Die Attach Materials

被引：0
|
作者：
Liu, Xiaojian [1 ]
Wang, Chunqing [1 ]
Zheng, Zhen [1 ]
Liu, Wei [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Sch Mat Sci & Engn, Harbin, Peoples R China
来源：
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年
关键词：
Ag-Cu; uitrafine nanoparticles; die attach materials;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we propose an facile one-step reduction approach free of microwave-assisted heating or water bath heating to synthesize Ag-Cu nanoparticles (NPs). Results showed that fcc Ag-Cu NPs with an ultra-fine average size of 9 nm were achieved and expected to sinter at about 330 t which is much lower than the eutectic temperature of bulk Ag-Cu alloy (779 C) according to the analysis of TG/DSC. This study provided a new SiC die attach materials with good properties at high temperature.
引用
收藏
页码：206 / 208
页数：3
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