Development of a High-Performance Transfer Mold Power Module

被引：0
|
作者：
Ohki, Y.
机构：
来源：
IEEE ELECTRICAL INSULATION MAGAZINE | 2012年 / 28卷 / 05期
关键词：
D O I：
10.1109/MEI.2012.6268447
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：66 / 67
页数：2
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