Low-Cost Antenna-in-Package Solution for 122 GHz Radar Module

被引：0

作者：

Bhutani, Akanksha ^{[1
]}

Goettel, Benjamin ^{[1
]}

Streitz, Thomas ^{[1
]}

Scherr, Steffen ^{[1
]}

Winkler, Wolfgang ^{[2
]}

Zwick, Thomas ^{[1
]}

机构：

[1] Karlsruhe Inst Technol, Inst Radio Frequency Engn & Elect, Karlsruhe, Germany

[2] Silicon Radar GmbH, Frankfurt, Germany

来源：

2016 11TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC) | 2016年

关键词：

Antenna-in-Package; glob-top packaging; millimeter-wave antenna; wirebond interconnect;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a glob-top packaging solution using thermally conductive adhesive Polytec TC 430-T is demonstrated which can be adapted for mass production using standard assembly effort. The packaging concept is first tested on two dummy chips connected by lambda/2 wirebonds. Thereafter, the packaging concept is implemented on a 122 GHz wirebond based Antenna-in-Package (AiP). The off-chip circuitry of the AiP contains a monostatic circularly polarized (CP) microstrip patch antenna and a branchline coupler. Finally, the feasibility of realizing a 122 GHz low-cost, fully integrated, surface mountable monostatic radar sensor package is evaluated on the basis of simulations and probe based measurements carried out in the frequency range of 110 GHz and 170 GHz.

引用

页码：540 / 543

页数：4

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