共 50 条
- [1] Effects of Pd distribution at free air ball in Pd coated Cu wire 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
- [2] Investigation of Palladium Distribution on the Free Air Ball of Pd-coated Cu Wire 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 777 - 782
- [4] Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 891 - 901
- [6] Wire Bonding of Cu and Pd Coated Cu Wire: Bondability, Reliability, and IMC Formation 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1489 - 1495
- [7] A Study of Free Air Ball Formation in Palladium-coated Copper and Bare Copper Bonding Wire 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1556 - 1563
- [8] Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (08): : 1389 - 1393
- [9] Study of Pd Mixing During Pd-Cu Wire Ball Formation and Impact on Wire Bond Quality 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1939 - 1944