Using an Intelligent Approach to Recognize a Wafer Bin Map Pattern

被引：0
|
作者：
Liu, Shu Fan [1 ]
Chen, Fei Long [2 ]
Chung, An Sheng [2 ]
机构：
[1] Yuanpei Univ Technol, Dept Informat Management, Hsingchu 30015, Taiwan
[2] Natl Tsing Hua Univ, Dept Ind Engn & Engn Management, Hsinchu 30013, Taiwan
来源：
FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE II, PTS 1-6 | 2012年 / 121-126卷
关键词：
Semiconductor; Wafer Bin Map; Pattern Recognition; FABRICATION;
D O I：
10.4028/www.scientific.net/AMM.121-126.1344
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
To decrease cost, semiconductor manufacturing companies always aim for yield enhancement. The analysis of Wafer Bin Maps (WBMs) is important for yield improvement. Real data sets are collected from a famous semiconductor manufacturing company to verify the presented method. Four types of WBMs patterns, center, edge, local, and ring types are selected for verification. Experimental results showed that with adequate parameter settings, the method can successfully recognize the pattern types and distinguish between random and systematic WBMs. There were 17 testing samples, and 16 of them were recognized correctly. The accuracy was 94.12%.
引用
收藏
页码：1344 / +
页数：2
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