Moisture Diffusion Model Verification of Packaging Materials

被引：0
|
作者：
Ma, Xiaosong [1 ]
Jansen, K. M. B. [1 ]
Ernst, L. J. [1 ]
van Driel, W. D. [3 ]
van der Sluis, O. [1 ,2 ]
Zhang, G. Q. [1 ,3 ]
Regard, Charles [4 ,5 ,6 ]
Gautier, Christian [4 ,5 ]
Fremont, Helene [6 ]
机构：
[1] Delft Univ Technol, Mekelweg 2, NL-2628 CD Delft, Netherlands
[2] Philips Appl Technol, Eindhoven, Netherlands
[3] NXP Gerstweg, Nijmegen, Netherlands
[4] Univ Caen, F-14032 Caen, France
[5] NXP Semicond, Toulouse, France
[6] Univ Bordeaux, F-33405 Talence, France
来源：
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop coming during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.
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收藏
页码：636 / +
页数：2
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