Epoxy resin (EP)/nano-SiO2 composite material preparation by two processes

Ultrasonic wave (UW) and sol-gel (SG) technology were using to preprocess the nano-SiO2, and the SiO2/EP composites were prepared by adding coupling agent KH-550, curing agent T-31 and different contents SiO2 into EP matrix. Using infrared spectra analysis tested the samples' structures and the thermal stability of two preparation processes were tested by TG. The results indicated that, the thermal stability of the SiO2/EP composites by UW preprocess was improved about 25 degrees C -60 degrees C when compared with pure EP and the SiO2/EP composites by SG. Comparing to the comprehensive evaluation of thermal stability of different SiO2 contents SiO2/EP composites, the most optimum additive of nano-SiO2 was about 10 wt. % by UW process.