Flat pipe cooling system for SMD chips

This paper describes a specific cooling system based on forced convection. The main purpose of the system is to evacuate the heat generated by power surface mount components like: high speed converters, high frequency clock synthesizers, linear circuits etc. During the study, the main heat transfer types as conductive and forced convection were described using a mathematical model of the system. Due to the fact that forced convection heat transfer is one of the most used cooling solutions in electronic design, the actual paper focuses on the design and implementation of a cooling system based on a flat aluminum pipe as airflow guidance element. A comparison between different materials and filling techniques for thermal via in order to achieve small thermal resistance was made as well.