Design toots for 3D mixed mode placement

被引：0
|
作者：
Li, ZY [1 ]
Yan, HX [1 ]
Hong, XL [1 ]
Zhou, Q [1 ]
Bian, JN [1 ]
Yang, HH [1 ]
Pitchumani, V [1 ]
机构：
[1] Tsinghua Univ, Dept Comp Sci & Technol, Beijing 100084, Peoples R China
来源：
2005 6TH INTERNATIONAL CONFERENCE ON ASIC PROCEEDINGS, BOOKS 1 AND 2 | 2005年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
We present a set of design tools for three dimensional (3D) mixed mode placement (MMP). The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool, route planning tool, and 2D global/detailed placement tools. We have analyzed the performance of 3D circuit using these tools. It is shown that total wirelength could be reduced by 25% to 43% compared with traditional 2D design using two to four stacked dies. By incorporating thermal management and analysis, we also investigate the thermal scalability of 3D integration.
引用
收藏
页码：796 / 799
页数：4
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