Effect of AISI-304 SS Substrate on Ti and Cr Thin Films with Finite Element Simulation

被引:0
|
作者
Ma Yong [1 ]
Yu Haifeng [1 ]
Tian Linhai [1 ]
Zhang Xiangyu [1 ]
Tang Bin [1 ]
机构
[1] Taiyuan Univ Technol, Res Inst Surface Engn, Taiyuan 030024, Peoples R China
关键词
nanoindentation; finite element simulation; forward analysis; metal thin films; substrate; MEASURING ELASTOPLASTIC PROPERTIES; PLASTIC PROPERTIES; MECHANICAL-PROPERTIES; ELASTIC-MODULUS; INDENTATION; DEPTH; EXTRACT; LOAD;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Based on finite element simulation of nanoindentation, that is, forward analysis, the effect of AISI-304 SS substrate on Ti and Cr thin films was studied. Ti/AISI-304 SS is a soft film/hard substrate system, while Cr/AISI-304 SS is a hard film/soft substrate system. According to the practical working condition, in forward analysis the power law constitution was adopted with the elasto-plastic parameters of thin films and substrate given. Through forward analysis, it can be found that the substrate has a more apparent influence on elastic modulus of thin films than on hardness, and that the 10% rule is not applicable when it comes to elastic modulus. The Von Mises equivalent plastic strain distributions of Ti/AISI-304 SS and Cr/AISI-304 SS indicate that the soft film/hard substrate system has a sinking-in phenomenon and the hard film/soft substrate system has a piling-up phenomenon. Through the Von Mises equivalent stress distributions of Ti/AISI-304 SS and Cr/AISI-304 SS, their failure positions and modes were determined. Radial crack occurs on the surface of Ti film while circumferential crack occurs on the Cr film surface.
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页码:553 / 556
页数:4
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