共 5 条
- [2] Heat shield - An enhancement device for an unshrouded, forced convection heat sink (Reprinted from the IEEE ITHERM 2004 Proceedings - The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 1-4, 2004, Las Vegas, NV, USA) JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (02) : 172 - 176
- [3] Modeling of natural convection in electronic enclosures (Reprinted from IEEE ITHERM 2004 Proceedings - The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 1-4, 2004, Las Vegas, NV, USA) JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (02) : 157 - 165
- [4] Rapid thermal characterization of the high thermal conductivity film layers by the film-on substrate technique (Reprinted from IEEE ITHERM 2004 Proceedings - The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 1-4, 2004, Las Vegas, NV, USA) JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (02) : 125 - 129
- [5] An experimental study of the enhancement of air-cooling limits for telecom/datacom heat sinks applications using an impinging air jet ITHERM 2004, VOL 1, 2004, : 150 - 156