Interlayer dielectrics based on copolyimides containing non-coplanar alicyclic-units for multilevel high-speed electronics

被引：14

作者：

Barzic, A., I ^{[1
]}

Hulubei, C. ^{[1
]}

Asandulesa, M. ^{[1
]}

Lisa, G. ^{[2
]}

Popovici, D. ^{[1
]}

Stoica, I ^{[1
]}

Nicolescu, A. ^{[1
]}

Albu, R. M. ^{[1
]}

机构：

[1] Petru Poni Inst Macromol Chem, 41A Grigore Ghica Voda Alley, Iasi 700487, Romania

[2] Tech Univ, Gheorghe Asachi Fac Chem Engn & Environm Protect, 73 Dimitrie Mangeron Bdv, Iasi 700050, Romania

来源：

POLYMER TESTING | 2020年 / 90卷

关键词：

Dielectric; Heat resistance; Morphology; Adhesion; RC delay; THERMAL-DEGRADATION; CONSTANT MATERIALS; POLYIMIDE FILMS; THIN-FILMS; POLYMERS; KINETICS;

D O I：

10.1016/j.polymertesting.2020.106704

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A series of copolyimides (CPIs) containing non-coplanar alicyclic units combined with fluorinated or rigid aromatic monomer segments is synthesized. The solid film samples display an elevated heat resistance as their degradation started at temperatures around 415 degrees C. Introduction into CPI backbone of bicyclic units, aromatic/aliphatic rings, angular bonds and/or low polarizable groups, determine the variation of the dielectric constant in the range 2.44-3.04 at 100 Hz. When using these CPIs as interlayer dielectrics (ILDs), it is revealed that resistance-capacitance delay is minimized (similar to 10(-11) s) determining faster response of the device. Atomic force microscopy scans of CPI samples show distinct macromolecular architectures, all containing nanopores with features depending on the chemical structure. Interfacial adhesion of investigated ILDs with copper wiring is highest for the samples lacking fluorine groups.

引用

页数：11