Hyperdimensional Computing with 3D VRRAM In-Memory Kernels: Device-Architecture Co-Design for Energy-Efficient, Error-Resilient Language Recognition

被引:0
|
作者
Li, Haitong [1 ]
Wu, Tony F. [1 ]
Rahimi, Abbas [2 ]
Li, Kai-Shin [3 ]
Rusch, Miles [2 ]
Lin, Chang-Hsien [3 ]
Hsu, Juo-Luen [3 ]
Sabry, Mohamed M. [1 ]
Eryilmaz, S. Burc [1 ]
Sohn, Joon [1 ]
Chiu, Wen-Cheng [3 ]
Chen, Min-Cheng [3 ]
Wu, Tsung-Ta [3 ]
Shieh, Jia-Min [3 ]
Yeh, Wen-Kuan [3 ]
Rabaey, Jan M. [2 ]
Mitra, Subhasish [1 ]
Wong, H. -S. Philip [1 ]
机构
[1] Stanford Univ, Stanford, CA 94305 USA
[2] Univ Calif Berkeley, Berkeley, CA 94720 USA
[3] Natl Nano Device Labs, Hsinchu, Taiwan
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ability to learn from few examples, known as one-shot learning, is a hallmark of human cognition. Hyperdimensional (HD) computing is a brain-inspired computational framework capable of one-shot learning, using random binary vectors with high dimensionality. Device-architecture co-design of HD cognitive computing systems using 3D VRRAM/CMOS is presented for language recognition. Multiplication-addition-permutation (MAP), the central operations of HD computing, are experimentally demonstrated on 4-layer 3D VRRAM/FinFET as non-volatile in-memory MAP kernels. Extensive cycle-to-cycle (up to 10(12) cycles) and wafer-level device-to-device (256 RRAMs) experiments are performed to validate reproducibility and robustness. For 28-nm node, the 3D in-memory architecture reduces total energy consumption by 52.2% with 412 times less area compared with LP digital design (using registers as memory), owing to the energy-efficient VRRAM MAP kernels and dense connectivity. Meanwhile, the system trained with 21 samples texts achieves 90.4% accuracy recognizing 21 European languages on 21,000 test sentences. Hard-error analysis shows the HD architecture is amazingly resilient to RRAM endurance failures, making the use of various types of RRAMs/CBRAMs (1k similar to 10M endurance) feasible.
引用
收藏
页数:4
相关论文
共 3 条
  • [1] Device-Architecture Co-Design for Hyperdimensional Computing with 3D Vertical Resistive Switching Random Access Memory (3D VRRAM)
    Li, Haitong
    Wu, Tony F.
    Mitra, Subhasish
    Wong, H. -S. Philip
    2017 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2017,
  • [2] In-Memory 3D NAND Flash Hyperdimensional Computing Engine for Energy-Efficient SARS-CoV-2 Genome Sequencing
    Hsu, Po-Kai
    Yu, Shimeng
    2022 14TH IEEE INTERNATIONAL MEMORY WORKSHOP (IMW 2022), 2022, : 65 - 68
  • [3] ACE-SNN: Algorithm-Hardware Co-design of Energy-Efficient & Low-Latency Deep Spiking Neural Networks for 3D Image Recognition
    Datta, Gourav
    Kundu, Souvik
    Jaiswal, Akhilesh R.
    Beerel, Peter A.
    FRONTIERS IN NEUROSCIENCE, 2022, 16