Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

被引：2
|
作者：
Lee, Hyunsuk [1 ]
Kim, Heegon [1 ]
Choi, Sumin [1 ]
Lim, Jaemin [1 ]
Cho, Kyungjun [1 ]
Jeon, Yeseul [1 ]
Kim, Joungho [1 ]
机构：
[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, Daejeon, South Korea
来源：
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2016年
关键词：
bump-less high-speed through silicon via (TSV) channel; eye-diagram; signal integrity; terabyte/s bandwidth 2.5D IC; voltage transfer function;
D O I：
10.1109/ECTC.2016.379
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a bump-less high-speed through silicon via (TSV) channel is proposed for terabyte/s bandwidth 2.5D IC. The signal integrity of the proposed channel is analyzed based on the frequency and time domain simulation. To analyze the signal integrity of the proposed channel minutely, the proposed channel and the conventional channel are simulated and compared respectively. Moreover, unlike the conventional channel, the signal integrity of the proposed channel is significantly affected by the coupling pads capacitance. Therefore, the proposed channel performance is investigated with different coupling pads capacitances.
引用
收藏
页码：2519 / 2522
页数：4
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