Evaluations of Nb-25 wt%Ti alloy wires

被引:1
|
作者
Tachikawa, K [1 ]
Abe, N [1 ]
Yamada, Y [1 ]
机构
[1] Tokai Univ, Fac Engn, Hiratsuka, Kanagawa 2591292, Japan
关键词
D O I
10.1109/77.784693
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An arc-melted Nb-25 wt%Ti alloy was fabricated into monocore wires with Cu matrix. The structure and superconducting properties of the wires were compared with those of Nb-46.5 wt%Ti and Nb-36 wt%Ti wires prepared by a similar process. The formation of a thick Cu-Ti-Nb compound layer is observed at the Cu/Nb-46.5Ti interface after heat treatment at above 600 degrees C. A thin compound layer is also formed at the Cu/Nb-36Ti interface after beat treatment. Meanwhile, no compound layer is observed at the Cu/Nb-25Ti interface. This is a major advantage of Nb-25Ti wile, which may save the wrapping of Nh foil around the cores to prevent the reaction with the Cu matrix, when they are fabricated into fine filaments. The T-c of Nb-25Ti wile is about 0.7 K higher than that of Nb-46.5Ti wire. The T-c and B-c2 Of Nb-25Ti wire are less sensitive to the reduction ill diameter and the heat treatment compared to the Nb-46.5Ti wire. The B-c2(4.2 K) of Nb-25Ti as wire seems to be high enough for AC applications. The addition of boron enhances the T-c and B-c2 of Nb-25Ti alloy.
引用
收藏
页码:1563 / 1566
页数:4
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