Monolithic 3D stacking for neural network acceleration

被引：2
|
作者：
Kim, Bokyung [1 ]
Li, Hai [1 ]
机构：
[1] Duke Univ, Dept Elect & Comp Engn, Durham, NC 27708 USA
来源：
NATURE ELECTRONICS | 2023年 / 6卷 / 12期
关键词：
D O I：
10.1038/s41928-023-01098-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A 3D stackable computing-in-memory array that is based on resistive random-access memory could accelerate the implementation of machine learning algorithms.
引用
收藏
页码：937 / 938
页数：2
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