Constructing interconnected asymmetric conductive network in TPU fibrous film: Achieving low-reflection electromagnetic interference shielding and surperior thermal conductivity

Highly efficient and low reflective electromagnetic interference (EMI) shielding composites are of great significance to modern electronic devices. Furthermore, it is crucial to simultaneously achieve high EMI shielding performance with low reflectivity and superior thermal management capability in the composites. Herein, silver nanowires (AgNWs) layer was first introduced onto the electrospun TPU fibrous film decorated by Fe3O4@MWCNT. The unique asymmetric conductive network with interconnected thermally conductive path was successfully constructed from the TPU/Fe3O4@MWCNT fibrous film at the bottom for electromagnetic wave absorption, and the AgNWs layer at the upper for EMI shielding. The resultant film showed remarkable conductivity (2.22 x 10(5) S/m), excellent EMI shielding effectiveness up to 78.48 dB and a low reflection coefficient value of 0.56. Moreover, the film exhibited a superhigh in-plane thermal conductivity of 7.83 W m(-1) K-1, realized by 3D interconnected thermally conductive network of Fe3O4@MWCNT and AgNWs. As a result, when it was served as a thermal interface material of a working LED chip, the film exhibited excellent thermal management capability. This work opens a way to fabricate low reflective EMI shielding films with superior thermal management capability.