This paper implements an adaptive phase-field model to investigate the interfacial fracture in transversely isotropic piezoelectric composites under different electromechanical loadings using an isogeometric framework based on polynomial splines over hierarchical T-meshes (PHTsplines). The model introduces the interface and crack phase-field parameters to regularize the sharp interface and crack topologies, respectively and the regularized energy terms are incorporated corresponding to crack and interface evading the need for line integration along them. It also modifies the energy functional to scrutinize the interaction between interfacial damage and crack propagation in piezocomposites and thus is capable of capturing the fracture patterns including interfacial debonding, matrix cracking and their interactions under different electric fields. An adaptive mesh refinement scheme using PHT-splines is implemented to efficiently resolve for interface and crack phase-fields and track the complex crack propagation paths without any ad hoc criteria. The efficacy and robustness of the proposed model are demonstrated using a set of examples simulating the electromechanical fracture in piezoelectric composites. Moreover, different fracture mechanisms in composite materials including the crack nucleation, interfacial debonding, matrix cracking, crack propagation and coalescence are found to be precisely captured using the present modeling technique.
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Indian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, IndiaIndian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, India
Jain, Ishank
Muixi, Alba
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Univ Politecn Cataluna, BarcelonaTech, Barcelona 08034, SpainIndian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, India
Muixi, Alba
Annavarapu, Chandrasekhar
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Indian Inst Technol Madras, Dept Civil Engn, Chennai 600036, IndiaIndian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, India
Annavarapu, Chandrasekhar
Mulay, Shantanu S.
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Indian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, IndiaIndian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, India
Mulay, Shantanu S.
Rodriguez-Ferran, Antonio
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Indian Inst Technol Madras, Dept Civil Engn, Chennai 600036, India
Univ Politecn Cataluna, BarcelonaTech, Barcelona 08034, SpainIndian Inst Technol Madras, Dept Aerosp Engn, Chennai 600036, India
机构:
Univ Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, ItalyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy
Greco, Luigi
Patton, Alessia
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Univ Bundeswehr Munchen, Dept Civil Engn & Environm Sci, Werner Heisenberg Weg 39, D-85577 Neubiberg, GermanyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy
Patton, Alessia
Negri, Matteo
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Univ Pavia, Dept Math F Casorati, Via A Ferrata 5, I-27100 Pavia, ItalyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy
Negri, Matteo
Marengo, Alessandro
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Tetra Pak Packaging Solut, Via Delfini 1, I-41100 Modena, ItalyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy
Marengo, Alessandro
Perego, Umberto
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Politecn Milan, Dept Civil & Environm Engn, Piazza L da Vinci 32, I-20133 Milan, ItalyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy
Perego, Umberto
Reali, Alessandro
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Univ Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, ItalyUniv Pavia, Dept Civil Engn & Architecture, Via A Ferrata 3, I-27100 Pavia, Italy