Wideband Glass-Based Transitions from GCPW and SIW to RWG with High-Efficiency Mode Excitation for W-Band Compact Module Integration

被引：0

作者：

Yu, Bo ^{[1
]}

Wang, Zhigang ^{[1
]}

Wu, Peng ^{[2
]}

Xu, Ruimin ^{[1
]}

机构：

[1] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, Chengdu, Peoples R China

[2] Chinese Acad Sci, Aerosp Informat Res Inst, Beijing, Peoples R China

来源：

2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMC | 2023年

关键词：

Grounded coplanar waveguide (GCPW); substrate integrated waveguide (SIW); through glass via (TGV); W-band; rectangular waveguide (RWG); transition;

D O I：

10.1109/APMC57107.2023.10439838

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, broadband W-band transitions from grounded coplanar waveguide (GCPW) and substrate integrated waveguide (SIW) to rectangular waveguide (RWG) based on through glass via (TGV) technology have been newly proposed for compact glass packages. In order to achieve efficient mode excitation and conversion, additional TGVs are embedded within the resonant cavity, and parallel stub-line coupling structures are incorporated in the bottom metal layer. The embedded TGVs and parallel stub lines excite multiple resonance modes within the resonant cavity, thereby enhancing the bandwidth of the transition. Besides, the glass substrate can be directly installed on the open-ended RWG ports to simplify manufacturing and assembly. Furthermore, a GCPW-to-RWG transition with 20.3% bandwidth and a SIW-to-RWG transition with 24.7% bandwidth are designed as examples in the W-band.

引用

页码：291 / 293

页数：3