Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Heat dissipation has become a central issue for the development of the microelectronic industry. Thermal interface materials (TIMs) have been widely applied to electron component cooling, which is used to bond the heat spreader and the chip together. Most research on TIMs has only dealt with thermal conductivity enhancement. However, the mechanical properties and adhesion of TIMs are indispensable for practical applications, as well as postcleaning to remove TIMs. A graphene nanosheet/polyolefin elastomer (GNP/POE) film was designed and prepared by a facile method, in which the heat conduction paths were efficiently constructed, and the good mechanical properties of POE were reserved. The thermal conductivity of as-prepared GNP/POE film can reach 1.07 W m-1 K-1 at an extremely low filler loading of 0.62 wt %. Furthermore, the tensile strength, elongation at break, and adhesion of the prepared GNP/POE film are as good as those of commercial TIM productions. The prepared GNP/POE film can be used as TIMs for chip cooling and exhibits a good heat dissipation effect. Additionally, the prepared GNP/POE film can be peeled off from the chip without residue, after the chip has finished running, which is significant for practical production. This work provides valuable information and insight into the design and fabrication of TIMs in the future.