Plasma-controlled surface wettability: recent advances and future applications

被引:68
|
作者
Ma, Chuanlong [1 ]
Nikiforov, Anton [1 ]
Hegemann, Dirk [2 ]
De Geyter, Nathalie [1 ]
Morent, Rino [1 ]
Ostrikov, Kostya [3 ,4 ]
机构
[1] Univ Ghent, Dept Appl Phys, Res Unit Plasma Technol RUPT, Sint Pietersnieuwstr 41,B4, B-9000 Ghent, Belgium
[2] Empa, Swiss Fed Labs Mat Sci & Technol, St Gallen, Switzerland
[3] Queensland Univ Technol QUT, Sch Chem & Phys, Brisbane, Qld, Australia
[4] Queensland Univ Technol QUT, QUT Ctr Mat Sci, Brisbane, Qld, Australia
基金
瑞士国家科学基金会; 澳大利亚研究理事会;
关键词
Plasma surface modification; plasma activation; plasma polymerization; plasma patterning; surface wettability control; hydrophilic surface; hydrophobic surface; amphiphilic surface; water interaction; ATMOSPHERIC-PRESSURE PLASMA; DIELECTRIC BARRIER DISCHARGE; GAS AGGREGATION SOURCE; POLYMER-FILMS; SUPERHYDROPHOBIC SURFACES; HYDROPHOBIC RECOVERY; NONTHERMAL PLASMA; HEXAMETHYLDISILOXANE FILMS; ENVIRONMENTAL APPLICATIONS; POLYPROPYLENE MEMBRANES;
D O I
10.1080/09506608.2022.2047420
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Materials with the desirable surface wettability are of key importance in diverse applications. However, most of the existing chemical processes used for surface wettability control are often energy-inefficient, pollute the environment, and rely on harsh processing conditions. Therefore, highly-selective, green, and low-cost alternative fabrication techniques are in urgent demand. Low-temperature plasma processing is one such promising approach that satisfies the above requirements. In this review, we present recent advances in plasma processing to control surface wettability for diverse emerging applications in the environment, energy, and biomedicine fields. The underlying mechanisms of the plasma surface engineering, key features of the fabrication processes, and water-surface interactions are discussed. This review aims to guide further development of the plasma processing to effectively control the surface wettability of various surfaces. This effort is poised to contribute to the development of advanced functional materials targeting a broad range of applications.
引用
收藏
页码:82 / 119
页数:38
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